Luminus Devices is an established, fast-growing, and profitable pioneer in the development and manufacturing high-power LED solutions for automotive, medical, and industrial applications. Recognized as a global leader in color quality, human-centric lighting, and power density, we are architecting the future of specialty lighting. Headquartered in Silicon Valley and is backed by the world-leading resources of San’an Optoelectronics, we are seeking a visionary Product Development Engineer to drive innovation in semiconductor packaging and process technology.


We are looking for a high-impact engineer with at least 10 years of experience to lead the development of cutting-edge high-power LEDs. This role is designed for an innovator who can bridge the gap between abstract design concepts and high-performance, manufacturable reality.

 

Key Responsibilities:

  • Drive innovative thinking to develop high-power LED package concepts for diverse, high-stakes applications. Utilize new materials and processes to keep package performance at the forefront of the industry.
  • Lead the design and validation of optimized chip/package structures, collaborating closely with chip and epi teams in China to push the boundaries of performance.
  • Execute hands-on Design of Experiments (DOE) and rigorous optical performance testing to validate and refine breakthrough designs.
  • Lead product development cycles by working extensively with cross-functional groups.
  • Integrate Design for Manufacturability (DFM) and risk analysis (DFMEA/PFMEA) to ensure new packaging materials and processes are robust and scalable.
  • Actively generate intellectual property and collaborate with patent attorneys to secure the company’s technological advancements.
  • Manage complex development cycles as a project leader, ensuring seamless communication between stakeholders and cross-functional teams.

 

Qualifications for the Position:

  • Master’s or PhD degree in Engineering, Physics, Materials Science, or a related technical field.
  • Minimum 10 years of experience in semiconductor product development; specialized experience in the automotive sector is highly desirable.
  • Deep expertise in optoelectronic device package design and the development of manufacturing processes.
  • Proficiency in CAD is desirable.
  • A fundamental understanding of LED chip physics and device characteristics.
  • Experience working with overseas CMs is a plus, as is the ability to communicate in Mandarin.
  • Highly motivated individual and good team player with “whatever it takes” attitude and a proven track record of pushing ambitious projects toward successful market entry.
  • Able to travel internationally on an as-needed basis (typically less than 10%).

 

Benefits & Perks:

  • Medical/Dental/Vision Insurance
  • Paid Time Off & Holidays
  • 401k Retirement Savings Plan w/ Employer Match
  • Flexible Spending Accounts
  • Employee Assistance Program
  • Life/AD&D Insurance
  • And more!

 

Compensation Range: $150,000 - $175,000 / year

Title and compensation will be commensurate with experience and qualification.