Luminus, Inc. is a leading company focused on developing and marketing wide bandgap solutions to help customers migrate from conventional technologies to long-life & energy-efficient compound semiconductors.The company’s headquarters is in Silicon Valley and is wholly owned by San’an Optoelectronics, a world leading LED, SIC Power and RF chip manufacturer based in China. Combining technology originated from MIT with innovation from Silicon Valley, Luminus offers a comprehensive range of photonics solutions for global lighting markets, high-output specialty solutions for performance-driven markets including consumer displays, entertainment lighting and medical applications as well as SiC and GaN power semiconductor materials and components to help customers create robust, efficient high power products. We foster a work environment that's inclusive as well as diverse and if you are looking for a place where you can grow, work hard, and have fun, this is a GREAT opportunity to learn about the lighting technology world and be part of an exciting forward company! 

Job Summary:

We are looking for an Engineer with experience packaging uLED into module level technologies. This position will be based in Hsinchu City, Taiwan (R.O.C.).

Job Responsibilities:

  • Develop uLED products and systems for AR, automotive and industrial applications. This requires innovative thinking on package concepts, conducting optical performance testing and hands on experimentation to validate design.
  • Collaborate with the Asian wafer fabrication organization to co-develop uLED products from initial concepts through mass production in order to optimize performance and cost.
  • Be familiar with the Supply Chain for critical Bill of Material items, e.g. color conversion materials, backplane manufacturers, etc.
  • Manage multiple projects and track progress. Update the larger Project team on a weekly basis.
  • Generating intellectual property and work with patent attorneys to file patent applications.

Qualifications:

  • Master or PhD degree in engineering, physics, materials or related fields.
  • Minimum of 5 years of experience in the development of uLED packages and modules, including color conversion processes. A total of 10 years of experience in development of power semiconductor packages is desired.
  • Experience/knowledge with uLED transfer processes with the various backplane technologies.
  • Familiarity with control of uLED systems including drivers and I/O
  • Good understanding of uLED chip and device characteristics.
  • Experience working with CM’s is desirable.
  • Extensive practice with critical processes such as D/PFMEA for power semiconductor products.
  • Highly motivated individual and good team player. “Whatever it takes” attitude - Strong sense of project ownership with strong desire to push projects toward end goals.
  • Be able to travel internationally on a need basis. (up to 40%)

Title and compensation will be commensurate with experience and qualification.