Summary:

The main responsibility of this position is to support the introduction of new products into our electroplating processes. An understanding of MEMS/semiconductor fabrication techniques (photolithography, coating and chemical processing) is required. A successful person will be able to apply both technological fundamentals and process experience to continually improve existing processes, support new products, install new facilities, and reduce operating costs. A deep understanding of the principles of electroplating and electroless plating is required.

 Responsibilities:

·         Support existing and develop new plating processes.

·         Support plating process development for TSV projects.

·         Design and development of plating process of complex structures.

·         Use statistical methods to establish robust process controls and process capabilities, analyze process yield, and for experimental design and analysis.

 Requirements:

·         5+ years of electroplating experience.

·         Knowledge of alloy electroplating with focus on ferromagnetic materials.

·         TSV plating experience.

·         Electroless plating knowledge

·         Analytical skills.

·         Knowledge of metrology tools such as XRF, EDS, profilers, interferometers, sheet resistance.

·         Understanding of pulse/reverse plating.

·         Bachelor’s in Chemistry or Electrochemistry

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