HyperLight’s vision is a world where photonics is everywhere. HyperLight is a venture-backed start-up spun off from Harvard University in 2018 based on a revolutionary invention that enabled Thin-Film Lithium Niobate (TFLN). Our platform offers electro-optic bandwidth and power consumption performance with excellent cost efficiencies unmatched by other materials and can be processed into photonic integrated circuits at high yield and large volume. HyperLight is the global leader in commercializing the TFLN platform, enabling diverse customers spanning from telecom to quantum, unlocking previously unimagined new applications and performances.

HyperLight provides end-to-end, customized, scalable, and high performance photonic integrated circuits solutions for paying customers around the world for optical communications, sensing, and emerging photonic applications. We are a driven and forward-thinking team with extensive experience in design, engineering, scalable manufacturing, integrated photonics technologies, nanofabrication, device physics, and process development in semiconductor materials. We partner with our customers from conceptualization, design, and prototyping phases, all the way through mass production to achieve revolutionary system performance and functionality.

At HyperLight, our people are our greatest asset, and we manifest that by empowering our team in our interactions and business decisions. Our growing team is looking for an Advanced Packaging Process Integration Engineer. You will lead innovation and development of novel 2.5D and 3D semiconductor integration processes with TFLN for high-speed electro-optic applications. Address all levels of integration, including chip-level integration (e.g. chip on wafer, chip on substrate) as well as multi-chip module integration on PCBs. Perform theory-driven analyses of candidate approaches. Organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above). Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Develop and maintain relationships with relevant vendors and partner organizations. Organize and present results, in written reports, journal papers, and oral presentations. Create and manage work plans to meet or exceed schedule deadlines and technical expectations.

 

We provide:

  • Market competitive compensation.
  • Comprehensive Health Coverage: family and individual plans, vision, dental.
  • 401(k) Retirement plans with employee matching.
  • Life and disability insurance.
  • Flexible hybrid or remote work and vacation policies.
  • Commuter Benefits and Subsidy.
  • Professional growth and mentorship opportunities.

 

 

Role responsibilities include:

  • Take ownership of advanced microelectronics packaging of TFLN chiplets, including silicon interposer assemblies, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration.
  • Identify and assess the performance of packaging providers and technologies.
  • Deliver advanced packaged TFLN chiplets with RF performance met requirements.

This position requires:

  • Master's or PhD degree in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or a related field.
  • 5+ years of experience in developing, characterizing, and exercising semiconductor manufacturing processes and 2.5D and 3D advanced packaging.
  • 5+ years of experience with the design and analyses of electronic packaging failure modes in temperature cycling, shock, and vibration test conditions.
  • Knowledge of new packaging architectures, including multi-chip, chip on-chip, and chip on the wafer, and package architecture assembly and reliability challenges.
  • Knowledge of the types of packaging used today, gaps in today’s technologies and approaches, and goals and timelines of ongoing research and other efforts in advanced packaging.
  • Knowledge of substrate, bumping, packaging technologies, assembly process, packaging materials, reliability standards, and failure analysis.
  • Extreme attention to detail and organizational skills.
  • Excellent communication, analytical problem-solving, and decision-making skills.
  • Must be consistently professional, and a strong team player.
  • Self-starter who can accomplish assigned tasks with minimal direction.
  • Knowledge of the working principles of integrated photonic components is a plus.

Authorization to work in the US required.

HyperLight is an equal opportunity employer. All applicants will be considered for employment without attention to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.